Samsung and TSMC prepare for intense competition in 2nm chip technology

The competition in the semiconductor industry is intensifying as leading foundries TSMC and Samsung Electronics gear up to start mass production of next-generation 2-nanometer chips in the second half of this year. At the same time, Intel is pushing forward with its more advanced 1.8nm process to compete in the market.

Industry sources revealed that TSMC has already started receiving orders for its 2nm process node, which will be produced at its facilities in Taiwan. This new node will feature gate-all-around transistor architecture, offering significant improvements in performance, power efficiency, and transistor density compared to current processes.

On the other hand, Samsung Electronics, the second-largest player in the foundry market, is aiming to begin production of its 2nm chips by the second half of 2025. The company plans to start mass production of mobile chips using the 2nm process node within the year, with expectations that the Exynos 2600 chip will be one of the first products to utilize this technology.

While Samsung faced challenges with low yield rates when adopting the GAA architecture for its 3nm node process, it aims to leverage its experience to improve manufacturing stability and output at the 2nm level. TSMC, which currently dominates the foundry market, has achieved high yield rates for its 2nm process and is on track for stable volume production.

Market trends indicate strong demand for the 2nm node, surpassing that of the previous 3nm generation, driven by the needs of smartphone and high-performance computing applications. TSMC’s Chairman highlighted the robust interest from key customers, projecting that the company will fully utilize its 2nm production capacity by the end of this year.

Samsung is focused on attracting top tech clients to enhance its competitiveness in the advanced node market. To support this goal, the company has appointed Margaret Han, a former TSMC executive, to lead its US foundry business. Meanwhile, Intel is betting on its 1.8nm process, known as 18A, to reestablish itself in the foundry market, with plans for high-volume manufacturing in the second half of 2025.

While Intel faced delays in its 18A schedule, the company remains confident that it will be able to challenge TSMC and Samsung in advanced nodes. With the race for next-generation semiconductor technology heating up, industry players are striving to innovate and meet the increasing demands of the market.