GlobalFoundries Unveils New York Center for Advanced Packaging and Photonics

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GlobalFoundries (Nasdaq: GFS) (GF) has revealed its intention to establish an innovative center within its New York manufacturing plant for advanced packaging and testing of U.S.-produced crucial chips. This one-of-a-kind center, backed by investments from the State of New York and the U.S. Department of Commerce, seeks to facilitate the secure onshore production, processing, packaging, and testing of semiconductors in the United States. The primary goal is to address the escalating demand for GF’s silicon photonics and other vital chips required in essential sectors like AI, automotive, aerospace and defense, and communication.

The surge in artificial intelligence (AI) applications is propelling the acceptance of silicon photonics and 3D and heterogeneously integrated (HI) chips to ensure power, bandwidth, and density prerequisites in data centers and edge devices. Silicon photonics chips boast the potential to cater to power and performance necessities in paramount areas such as automotive, communication, radar systems, and other critical infrastructure applications. To cater to this surging demand, the New York Advanced Packaging and Photonics Center by GF is anticipated to provide:

1. State-of-the-art packaging, assembly, and testing for GF’s distinctive silicon photonics platform that amalgamates optical and electrical components on a single chip to achieve power efficiency and performance enhancements.
2. Comprehensive turnkey advanced packaging, bump, assembly, and testing services for aerospace and defense patrons under GF’s Trusted Foundry authorization. This guarantees that chips used in sensitive national security systems remain within the U.S. throughout production.
3. Novel production capabilities for advanced packaging, wafer-to-wafer bonding, assembly, and testing of 3D and HI chips using GF’s cutting-edge platforms like 12LP+, 22FDX®, among others.

Dr. Thomas Caulfield, President and CEO of GF, expressed pride in the collaborative efforts between state and federal entities for this groundbreaking center. The initiative is a direct response to customer demands for increased geodiversity in supply chains and enhanced support for advanced packaging solutions concerning GF’s silicon photonics, Trusted, and 3D/HI offerings. Dr. Caulfield emphasized the unique standing of the New York Advanced Packaging and Photonics Center within the industry, foreseeing its pivotal role in sustaining the growth of semiconductor manufacturing and innovation in the Empire State.

The New York Advanced Packaging and Photonics Center is poised to augment GF’s advanced packaging competencies by delivering an end-to-end U.S.-based solution for chips manufactured at GF’s New York plant. It’s worth mentioning that the bulk of advanced packaging activities in the semiconductor realm are predominantly situated in Asia, hinting at a groundbreaking change in the landscape with GF’s latest initiative.

The company’s projected investment in the New York Advanced Packaging and Photonics Center totals $575 million, coupled with an additional $186 million earmarked for research and development in the upcoming decade. These endeavors are forecasted to yield nearly 100 new permanent job opportunities at GF’s New York facility within the next five years. In supporting GF’s vision, New York State has stepped up with approximately $20 million in fresh funding for the center, alongside the previously announced $550 million allocation through the New York State Green CHIPS program. The U.S. Department of Commerce is set to furnish up to $75 million in direct funding to back the center, supplementing GF’s earlier grant under the CHIPS and Science Act.

GF’s ongoing commitment to its Malta, New York facility where nearly 2,500 employees are stationed has showcased a robust investment of over $16 billion since its inception in 2011. GF’s New York fabrication facility, holding Trusted Foundry accreditation, is instrumental in the production of secure chips in collaboration with the U.S. government. GlobalFoundries (GF) remains a frontrunner in manufacturing indispensable semiconductors critical to global operations in key industries. The company thrives on innovation, establishing partnerships, and delivering power-efficient, top-notch products across growth sectors like automotive, smart mobile devices, IoT, communication infrastructure, and more. With a global presence encompassing the U.S., Europe, and Asia, GF is a trusted provider renowned for security, longevity, and sustainability, upheld by its diverse and talented team committed to delivering exceptional results.

All trademarks, service marks, and related intellectual property featured are the exclusive property of GlobalFoundries Inc. or its subsidiaries, affirming the distinctiveness and credibility of GF’s brand legacy.

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